Patent · US Active

Method for manufacturing a micromechanical component

US9365417B2 · kind B2 · utility

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9Claims
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Assignee

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Key dates

Filing dateNov 25, 2014
Grant dateJun 14, 2016
Priority date
Expiry dateNov 25, 2034

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81C2203/0109
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

A method for manufacturing a micromechanical component includes the following sequential steps: a first material layer including a first joining partner being applied to a first wafer; a second material layer including a second joining partner being applied to a second wafer; a micromechanical structure being created in the first wafer by gas phase etching with the aid of a gaseous etching medium which is applied to the first joining partner; the first and second wafers being joined in such a way that they are in contact at least in some areas; and the first and second joining partners being heated to be integrally joined to form a connecting layer, a eutectic joining material being formed in the connecting layer from the first joining partner and the second joining partner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.