Method for manufacturing a micromechanical component
US9365417B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2014 |
| Grant date | Jun 14, 2016 |
| Priority date | — |
| Expiry date | Nov 25, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0109
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for manufacturing a micromechanical component includes the following sequential steps: a first material layer including a first joining partner being applied to a first wafer; a second material layer including a second joining partner being applied to a second wafer; a micromechanical structure being created in the first wafer by gas phase etching with the aid of a gaseous etching medium which is applied to the first joining partner; the first and second wafers being joined in such a way that they are in contact at least in some areas; and the first and second joining partners being heated to be integrally joined to form a connecting layer, a eutectic joining material being formed in the connecting layer from the first joining partner and the second joining partner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.