Patent · US Active

Pressure sensor package with integrated sealing

US9366593B2 · kind B2 · utility

2Cited by

16References

26Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Mathias Vaupel · Regensburg, DE
Horst Theuss · Wenzenbach, DE
Helmut Wietschorke · Laberweinting, DE

Key dates

Filing date	Sep 27, 2013
Grant date	Jun 14, 2016
Priority date	—
Expiry date	Jul 21, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1815
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A pressure sensor package includes a lead and a semiconductor die spaced apart from the lead and including a terminal and a diaphragm disposed at a first side of the die. The die is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The package further includes an electrical conductor connecting the terminal to the lead, a molding compound encasing the electrical conductor, the die and part of the lead, a cavity in the molding compound exposing the diaphragm, and a sealing ring disposed on a side of the molding compound with the cavity. The sealing ring surrounds the cavity and has a lower elastic modulus than the molding compound. Alternatively, the sealing ring can be a ridge of the molding compound that protrudes from the side of the molding compound with the cavity and surrounds the cavity. A package manufacturing method is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.