Integrated circuit package with multiple dies and queue allocation
US9367517B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2010 |
| Grant date | Jun 14, 2016 |
| Priority date | — |
| Expiry date | Mar 28, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A package includes a first die and a second die. The dies are connected to each other through an interface. At least one of the first and second dies includes a plurality of signal sources, wherein each source has at least one quality of service parameter associated therewith, and a plurality of queues having a different priorities. A signal from a respective one of the signal sources is allocated to one of the plurality of queues in dependence on the at least one quality of service parameter associated with the respective signal source. The interface is configured such that signals from said queues are transported from one of said first and second dies to the other of said first and second dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.