High density package interconnects
US9368437B2 · kind B2 · utility
6Cited by
16References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2011 |
| Grant date | Jun 14, 2016 |
| Priority date | — |
| Expiry date | Dec 31, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die and a first metal bump on the die, the first metal bump including a surface having a first part and a second part. The apparatus also includes a solder resistant coating covering the first part of the surface and leaving the second part of the surface uncovered. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.