Thin integrated circuit chip-on-board assembly
US9368468B2 · kind B2 · utility
3Cited by
59References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2014 |
| Grant date | Jun 14, 2016 |
| Priority date | — |
| Expiry date | Dec 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/85
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.