Metallic housing of electronic device and manufacturing method thereof
US9370823B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 26, 2013 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Apr 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/04
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A metallic housing of an electronic device, includes a metallic outer frame and an inner structural member. The metallic outer frame comprises a plurality of latching portions protruding, and a plurality of latching grooves. The inner structural member is made from metal-alloy and embedded in the outer frame by die-casting. The inner structural member comprises a peripheral sidewall, a plurality of engaging portions, and a plurality of matching portions. The plurality of engaging portions and the plurality of matching portions protrude from the peripheral sidewall outwardly. Each latching portion comprises at least two parallel latching ribs, and forms a receiving groove between two adjacent latching ribs. The plurality of engaging portions is respectively embedded in the plurality of receiving grooves, and the plurality of matching portions is respectively embedded in the plurality of latching grooves. The present disclosure further provides a manufacturing method for the metallic housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.