Semiconductor assembly having a housing
US9373563B2 · kind B2 · utility
3Cited by
10References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 20, 2007 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Aug 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor assembly, power semiconductor module, a housing and methods for assembling the power semiconductor housing is disclosed. One embodiment provides an electrically insulating substrate has an inner housing having a cover and a peripheral rim, and at least one pressure element arranged adjacent a side-face of the peripheral rim. The pressure element is resiliently coupled to the inner housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.