Patent · US Active

High power electronic component with multiple leadframes

US9373566B2 · kind B2 · utility

3Cited by

3References

18Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Ralf Otremba · Kaufbeuren, DE
Klaus Schiess · Allensbach, DE
Teck Sim Lee · Melaka City, MY

Key dates

Filing date	Mar 19, 2014
Grant date	Jun 21, 2016
Priority date	—
Expiry date	Apr 16, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In an embodiment an electronic component includes a semiconductor die having a first surface, the first surface including a first current electrode and a control electrode. The electronic component further includes a die pad having a first surface, a plurality of leads and a gull-wing shaped conductive element coupled to a first lead of the plurality of leads. The first current electrode is mounted on the die pad and the gull-wing shaped conductive element is coupled between the control electrode and the first lead.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.