Reflow process and tool
US9373603B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2014 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Feb 28, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/2026
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Reflow processes and apparatuses are disclosed. A process includes enclosing a package workpiece in an enclosed environment of a chamber of a reflow tool; causing an oxygen content of the enclosed environment of the chamber to be less than 40 ppm; and performing a reflow process in the enclosed environment of the chamber while the oxygen content is less than 40 ppm. An apparatus includes a reflow chamber, a door to the reflow chamber, an energy source in the reflow chamber, and gas supply equipment coupled to the chamber. The door is operable to enclose an environment in the reflow chamber. The energy source is operable to increase a temperature in the environment in the reflow chamber. The gas supply equipment is operable to provide a gas to the reflow chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.