Semiconductor package with optical port
US9374162B2 · kind B2 · utility
0Cited by
7References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2012 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Mar 23, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/801
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Described herein are technologies related to a semiconductor package that is installed in a portable device for data communications. More particularly, the semiconductor package that contains a memory, a digital logic chip, and an optical port in a single module or mold is described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.