Method of processing a semiconductor wafer such as to make prototypes and related apparatus
US9377678B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Nov 20, 2013 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Jun 28, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70425
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of processing a semiconductor wafer may include providing a rotatably alignable photolithography mask that includes different mask images. Each mask image may be in a corresponding different mask sector. The method may also include performing a series of exposures with the rotatably alignable photolithography mask at different rotational alignments with respect to the semiconductor wafer so that the different mask images produce at least one working semiconductor wafer sector, and at least one non-working semiconductor wafer sector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.