Method of fabricating an electronic circuit
US9378882B2 · kind B2 · utility
4Cited by
14References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2011 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Dec 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/2814
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Circuits and methods of fabricating circuits are disclosed herein. A method of fabricating an electronic circuit includes placing an electronic component on a substrate. A ferromagnetic material is mixed into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound. The mixed mold compound is applied to the substrate by way of a transfer mold process, wherein the mixed mold compound encapsulates the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.