Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9379074B2 · kind B2 · utility
70Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2014 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Apr 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus relating generally to a die stack is disclosed. In such an apparatus, a substrate is included. A first bond via array includes first wires each of a first length extending from a first surface of the substrate. An array of bump interconnects is disposed on the first surface. A die is interconnected to the substrate via the array of bump interconnects. A second bond via array includes second wires each of a second length different than the first length extending from a second surface of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.