Pressure application apparatus and pressure application method
US9379082B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 27, 2015 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Oct 27, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pressure application technique is provided that enables two objects to be pressurized (e.g., objects to be bonded) to be positioned with greater accuracy before having pressure applied thereto. The objects to be pressurized are moved relative to each other in a Z direction such that the objects are brought into contact with each other (step S13). Then, a horizontal positional shift ΔD between the objects to be pressurized is measured in the contact state of the objects to be pressurized (step S14). Thereafter, positioning of the objects to be pressurized is again performed by moving the objects to be pressurized relative to each other in the horizontal direction, as a result of which the positional shift ΔD is corrected (step S17).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.