System, apparatus, and method for split die interconnection
US9379090B1 · kind B1 · utility
30Cited by
0References
27Claims
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Assignee
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Key dates
| Filing date | Feb 13, 2015 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Feb 13, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15333
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package for a side by side die configuration may include a substrate having a cavity, a bridge interposer positioned within the cavity and having an active side facing active sides of a first die and a second die and partially horizontally overlapping the first die and the second die to provide an interconnection between the first die and the second die, and a thermal element attached to backsides of the first die and the second die to provide a heat path and heat storage for the first die and the second die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.