Device for stripping a product substrate from a carrier substrate
US9381732B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2014 |
| Grant date | Jul 5, 2016 |
| Priority date | — |
| Expiry date | Nov 25, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1967
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.