Patent · US Active

Smart card module, smart card body, smart card and smart card production method

US9384437B2 · kind B2 · utility

0Cited by

6References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Frank Pueschner · Kelheim, DE
Thomas Spoettl · Mintraching, DE
Jens Pohl · San Luis Obispo, US
Gottfried Beer · Nittendorf, DE

Key dates

Filing date	Apr 28, 2015
Grant date	Jul 5, 2016
Priority date	—
Expiry date	Apr 28, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/16238
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

In various embodiments, a smart card module is provided. The smart card module includes a carrier having a first main surface and a second main surface opposite the first main surface. The carrier has at least one plated-through hole. The smart card module further includes a contact array arranged above the first main surface of the carrier and having a plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts is electrically connected to the plated-through hole. The smart card module further includes a chip arranged above the second main surface. The chip is electrically coupled to at least one electrical contact of the plurality of electrical contacts by the plated-through hole. The smart card module further includes at least one optoelectronic component arranged above the second main surface and electrically conductively connected to the chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.