Sensor array packaging solution
US9389103B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2014 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Mar 24, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4298
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.