Packaging methods, material dispensing methods and apparatuses, and automated measurement systems
US9390060B2 · kind B2 · utility
1Cited by
74References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2012 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Jun 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Packaging methods, material dispensing methods and apparatuses, and automatic measurement systems are disclosed. In one embodiment, a method of packaging semiconductor devices includes coupling a second die to a top surface of a first die, dispensing a first amount of underfill material between the first die and the second die, and capturing an image of the underfill material. Based on the image captured, a second amount or no additional amount of underfill material is dispensed between the first die and the second die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.