Substrate transfer apparatus and method, and substrate processing apparatus
US9390957B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 25, 2014 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Nov 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a substrate transfer apparatus and method and a substrate processing apparatus. The substrate transfer apparatus includes: a body portion; an arm part coupled to the body portion, the arm part moving to allow the substrate to be transferred; a suction part provided with the arm portion, the suction part suctioning and fixing the substrate; and a control part controlling an operation of the substrate transfer apparatus, wherein the control part changes a suction point on the substrate to re-attempt suction when suction of the substrate by the suction part is unsuccessful.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.