Built-up lead frame QFN and DFN packages and method of making thereof

US9391007B1 · kind B1 · utility

Assignee

• NXP B.V. · NL

Inventors

• Shun Tik Yeung · Kwai Chung, CN
• Pompeo V. Umali · Kwai Chung, CN
• Chi Ho Leung · Kowloon, CN
• Kan Wae Lam · Sha Tin, CN
• Chi Ling Shum · Kwai Chung, CN

Key dates

• Filing date: Jun 22, 2015
• Grant date: Jul 12, 2016
• Expiry date: Jun 22, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Consistent with an example embodiment, a semiconductor device comprises a device die having bond pads providing connection to device die circuitry. The semiconductor device includes a QFN package (quad-flat-pack no-leads) built-up substrate lead frame having, a sub-structure of I/O terminals and a die attach area, the I/O terminals and die attach area enveloped in a molding compound; the die attach area has exposed areas to facilitate device die attachment thereon and the terminal I/O terminals provide connection to the device die bond pads. I/O terminals are electrically coupled with one another and to the die attach area with connection traces. The coupled I/O terminals and connection traces facilitate electroplating of exposed vertical surfaces of the I/O terminals during assembly, said connection traces being severed after assembly. Molding compound encapsulates the device die on the built-up substrate lead frame. The exposed vertical surfaces of the I/O terminals enhance the solderability of the assembled QFN device during placement onto a printed circuit board.