Polishing method and polishing system
US9393665B2 · kind B2 · utility
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14References
34Claims
0Family size
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Key dates
| Filing date | Aug 5, 2011 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Apr 22, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing method and a polishing system are provided. By means of adjusting a rotational center of a polishing article corresponding to positions of a polishing pad or polishing pads, a polishing rate of the polishing article surface has a better uniformity, resulted from compensation of polishing rates at the rotational center of the polishing article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.