Package on package devices and methods of packaging semiconductor dies
US9397080B2 · kind B2 · utility
6Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2015 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Mar 13, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3651
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of packaging semiconductor dies may include: coupling a first die to a first substrate; forming a plurality of first portions of a plurality of metal pillars on a surface of the first substrate; forming a second portion of the plurality of metal pillars over each of the plurality of first portions of the plurality of metal pillars; forming a protection layer over sidewalls of each of the plurality of first portions and second portions of the plurality of metal pillars; coupling a second die to a second substrate; and coupling the plurality of metal pillars to the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.