Microelectronic substrate electro processing system
US9399827B2 · kind B2 · utility
1Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2014 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Apr 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76879
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.