System and method for a pump with onboard electronics
US9399989B2 · kind B2 · utility
3Cited by
163References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2013 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Sep 9, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/87885
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present invention provide pumps with features to reduce form factor and increase reliability and serviceability. Additionally, embodiments of the present invention provide features for gentle fluid handling characteristics. Embodiments of the present invention can include a pump having onboard electronics and features to prevent heat from the onboard electronics from degrading process fluid or otherwise negatively impacting pump performance. Embodiments may also include features for reducing the likelihood that fluid will enter an electronics housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.