Using high resolution full die image data for inspection
US9401016B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 8, 2015 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | May 8, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for determining a position of inspection data with respect to a stored high resolution die image are provided. One method includes aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites. The predetermined alignment sites have a predetermined position in die image space of a stored high resolution die image for the wafer. The method also includes determining positions of the alignment sites in the die image space based on the predetermined positions of the predetermined alignment sites in the die image space. In addition, the method includes determining a position of inspection data acquired for the wafer by the inspection system in the die image space based on the positions of the alignment sites in the die image space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.