Patent · US Active

Method and device for transferring a chip to a contact substrate

US9401298B2 · kind B2 · utility

6Cited by

2References

10Claims

0Family size

Assignee

Pac Tech—Packaging Technologies Gmbh · DE

Inventors

Elke Zakel · Falkensee, DE
Ghassem Azdasht · Berlin, DE

Key dates

Filing date	Apr 10, 2006
Grant date	Jul 26, 2016
Priority date	—
Expiry date	May 11, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and device for transferring a chip (18) situated on a transfer substrate (26) to a contact substrate (50), and for contacting the chip with the contact substrate, in which the chip, the back side (19) of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts (59, 60) thereof that are arranged opposite a contact surface (58) of the contact substrate are brought into contact with substrate contacts (56, 57) arranged on the contact surface by means of a pressing device (45, 46) from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.