Low-dielectric resin composition and copper-clad laminate and printed circuit board using the same
US9402310B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2014 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Jan 17, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31696
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a resin composition useful for a copper-clad laminate and a printed circuit board, wherein the resin composition comprises the following components: (A) 100 parts by weight of vinyl-containing polyphenylene ether resin; (B) 5 to 50 parts by weight of maleimide; (C) 10 to 100 parts by weight of styrene-butadiene copolymer; and (D) 5 to 30 parts by weight of cyanate ester resin. The present invention also provides a resin composition and an article made therefrom having low dissipation factor at high frequency and excellent thermal resistance and peeling strength and being useful for a copper-clad laminate and a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.