Wenjun Tian
8Patents
1h-index
12Co-inventors
40Inventor score
Filing activity: Feb 26, 2013 → Nov 15, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9447238B2 | Polyphenylene oxide resin, method of preparing polyphenylene oxide resin, polyphenylene oxide prepolymer and resin composition | Chemistry; Metallurgy | 3 | Active |
| US9402310B2 | Low-dielectric resin composition and copper-clad laminate and printed circuit board using the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US9469757B2 | Low dissipation factor resin composition and product made thereby | Chemistry; Metallurgy | 1 | Active |
| US9850375B2 | Resin composition, copper clad laminate and printed circuit board using same | Electricity | 1 | Active |
| US9574070B2 | Aromatic tetrafunctional vinylbenzyl resin composition and use thereof | Electricity | 0 | Active |
| US9650512B2 | Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US9131607B2 | Lowdielectric resin composition, copper clad laminate using the same, and printed circuit board using the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US10072148B2 | Resin composition, copper clad laminate and printed circuit board using same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.