Low dielectric resin composition, and resin film, prepreg, printed circuit board made thereby
US9403981B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 5, 2015 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Jun 5, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0358
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition, including (A) a polyimide resin; (B) a pre-polymerized maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4′-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerized maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.