Substrate support with radio frequency (RF) return path
US9404176B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2013 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Feb 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/34
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of substrate supports having a radio frequency (RF) return path are provided herein. In some embodiments, a substrate support may include a dielectric support body having a support surface to support a substrate thereon and an opposing second surface; a chucking electrode disposed within the support body proximate the support surface; and an RF return path electrode disposed on the second surface of the dielectric support body. In some embodiments, a substrate processing system may include a process chamber having an inner volume; a shield to separate the inner volume into a processing volume and a non-processing volume and extending toward a ceiling of the process chamber; and a substrate support disposed below the shield, wherein the substrate support is as described above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.