Laser annealing device including tunable mask and method of using the same
US9406515B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Nov 17, 2015 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Nov 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A laser annealing device for compensating wafer heat maps and its method are disclosed. A laser annealing device comprises a pump laser source array including of a plurality of pump laser sources for irradiating a tunable mask, each pump laser source emitting pump laser, an annealing laser source for emitting annealing laser and irradiating the tunable mask, and a tunable mask for transmitting at least part of the annealing laser after being irradiated by the pump laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.