Cover opening/closing apparatus, thermal processing apparatus using the same, and cover opening/closing method
US9406537B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2013 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Dec 8, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67772
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a cover opening/closing apparatus which includes: a wafer conveyance port having an opening edge and configured to be opened/closed by an opening/closing door; and a cover removal apparatus installed on the opening/closing door and configured to remove a cover of a FOUP which is formed with a substrate outlet having a opening edge. When the cover removal apparatus removes the cover of the FOUP, the opening edge of the substrate outlet is closely contacted with the opening edge of the wafer conveyance port. The cover removal apparatus includes: a latch key which is engaged with the cover of the FOUP, a driving unit configured to drive the latch key, and an accommodation unit configured to accommodate the driving unit. The cover opening/closing apparatus further includes an exhaust system configured to exhaust a space within the accommodation unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.