Patent · US Active

Component in the form of a wafer level package and method for manufacturing same

US9406747B2 · kind B2 · utility

0Cited by

1References

3Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Heribert Weber · Leverkusen, DE
Hartmut Kueppers · Reutlingen, DE
Jens Frey · Echterdingen, DE
Neil Davies · Sedgefield, GB
Jochen Reinmuth · Reutlingen, DE

Key dates

Filing date	Jun 17, 2014
Grant date	Aug 2, 2016
Priority date	—
Expiry date	Jun 17, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2225/06568
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A vertically integrated hybrid component is implemented in the form of a wafer level package including: at least two element substrates assembled one above the other; a molded upper sealing layer made of an electrically insulating casting; and an external electrical contacting of the component being implemented on the top side via at least one contact stamp which is embedded in the sealing layer so that (i) its lower end is connected to a wiring level of an element substrate and (ii) its upper end is exposed in the surface of the sealing layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.