Microphone package with embedded ASIC
US9407997B2 · kind B2 · utility
2Cited by
37References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2011 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Jan 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A packaged microphone has a base, a lid coupled to the base forming an interior, a MEMS microphone secured to the base within the interior, and an integrated circuit embedded in the base. Apertures in the base and integrated circuit are aligned to form an aperture from the exterior of the package to the interior.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.