Patent · US Active

Integrated circuit assembly and method of making

US9412644B2 · kind B2 · utility

2Cited by

58References

14Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Michael A. Stuber · Carlsbad, US
Stuart B. Molin · Carlsbad, US
Mark Drucker · Poway, US
Peter Fowler · Bristol, GB

Key dates

Filing date	Dec 16, 2014
Grant date	Aug 9, 2016
Priority date	—
Expiry date	Dec 16, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH10D84/85
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A first wafer is provided that includes an insulating layer, a first active layer, and a handle layer. The insulating layer has a first surface and a second surface. The first active layer contacts the first surface of the insulating layer. The handle layer contacts the second surface of the insulating layer. A second wafer is provided that includes a substrate and a second active layer. The substrate has a first surface and a second surface. The second active layer contacts the first surface of the substrate. The second wafer is bonded to the first wafer by physically connecting the first active layer to the second surface of the substrate. The handle layer is removed. A metal bond pad is formed on the second surface of the insulating layer. The metal bond pad is electrically connected to the first active layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.