Semiconductor package including an embedded circuit component within a support structure of the package
US9414497B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2015 |
| Grant date | Aug 9, 2016 |
| Priority date | — |
| Expiry date | Jul 31, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10507
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a cavity formed in a support structure, the support structure being operable to support a semiconductor device. A circuit element is disposed in the cavity in the support structure, and the cavity in the support structure is filled with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material. The semiconductor device is electrically connected to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.