Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements

US9416000B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Christoph Schelling · Stuttgart, DE
• Ralf Reichenbach · Eßlingen, DE
• Jens Frey · Echterdingen, DE
• Antoine Puygranier · Asperg, DE

Key dates

• Filing date: Jun 5, 2015
• Grant date: Aug 16, 2016
• Expiry date: Jun 5, 2035

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/037
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

To implement cavities having different internal pressures in joining two semiconductor elements, at least one of the two element surfaces to be joined is structured, so that at least one circumferential bonding frame area is recessed or elevated in comparison with at least one other circumferential bonding frame area. At least one connecting layer should then be applied to this structured element surface and at least two circumferential bonding frames should be structured out of this connecting layer on different surface levels of the element surface. The topography created in the element surface permits sequential bonding in which multiple cavities between the two elements may be successively hermetically sealed, so that a defined internal pressure prevails in each of the cavities.