Low-e panels and methods for forming the same
US9416049B2 · kind B2 · utility
1Cited by
12References
15Claims
0Family size
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Key dates
| Filing date | Jun 23, 2014 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Aug 2, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2218/15
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Embodiments provided herein describe low-e panels and methods for forming low-e panels. A transparent substrate is provided. A reflective layer is formed above the transparent substrate. A dielectric layer is formed between the transparent substrate and the reflective layer. The dielectric layer includes niobium, tin, and aluminum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.