Patent · US Active

Wafer processing method

US9418908B2 · kind B2 · utility

2Cited by

1References

5Claims

0Family size

Assignee

DISCO CORPORATION · JP

Inventors

Makoto Tanaka · Ome, JP
Xin Lu · Tokyo, JP
Sax Liao · Hsinchu, TW

Key dates

Filing date	Jul 28, 2015
Grant date	Aug 16, 2016
Priority date	—
Expiry date	Jul 28, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/12
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A wafer processing method includes a first correction step of measuring a distance “a” between a first cut groove previously formed by a first cutting unit and a division line for the next cut groove, and correcting an actual index amount by using a deviation “b” of the first cutting unit equivalent to the difference between the distance “a” and a proper index amount of the first cutting unit, and a second correction step of forming a measurement groove by using a second cutting unit along the division line for the next cut groove, measuring a distance “c” between the first cut groove and the measurement groove, and correcting an actual index amount of the second cutting unit by using a deviation “d” equivalent to the difference between the distance “c” and a proper index amount of the second cutting unit during the cutting step.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.