Package substrates, semiconductor packages having the package substrates
US9418914B2 · kind B2 · utility
0Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2013 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Feb 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48228
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Package substrates, semiconductor packages including the package substrates, and methods for fabricating the semiconductor packages are provided. A package substrate may include a core including a first surface on which a semiconductor chip is disposed and a second surface opposite the first surface. The package substrate may also include a metal pad on the second surface of the core. The metal pad may include a saline water corrosion resistant surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.