Patent · US Active

Lead for connection to a semiconductor device

US9418918B2 · kind B2 · utility

4Cited by

0References

17Claims

0Family size

Assignee

NXP B.V. · NL

Inventors

Roelf Anco Jacob Groenhuis · Nijmegen, NL
Tim Boettcher · Scheeßel, DE

Key dates

Filing date	Mar 25, 2015
Grant date	Aug 16, 2016
Priority date	—
Expiry date	Mar 25, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/84801
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

There is disclosed a lead for connection to a semiconductor device die, the lead comprising a clip portion. The clip portion comprises a major surface having two or more protrusions extending therefrom for connection to a bond pad of the semiconductor device die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.