Method of manufacturing a semiconductor component and structure
US9419069B2 · kind B2 · utility
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15References
6Claims
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Key dates
| Filing date | Jun 27, 2014 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Jun 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.