Optoelectronic component and method for producing an opto-electronic component
US9419193B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 5, 2010 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | May 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An opto-electronic component has a carrier element (3) with a connection region (5). Arranged on the carrier element (3) is a semiconductor chip (7). A contact region (10) is mounted on the surface (8) of the semiconductor chip (7) remote from the carrier element (3). The connection region (5) is electrically conductively connected to the contact region (10) by way of an unsupported conductive structure (13). A method for manufacturing an opto-electronic component is described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.