Method of making a circuitized substrate
US9420689B2 · kind B2 · utility
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30References
8Claims
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Key dates
| Filing date | Oct 20, 2009 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Jan 16, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a quantity of powders of nano-particle and/or micro-particle sizes. The resistor serves to decrease the capacitance in the formed circuit while only slightly increasing the high frequency resistance, thereby improving circuit performance through the substantial elimination of some discontinuities known to exist in structures like these. An electrical assembly (substrate and at least one electrical component) is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.