i3 Electronics, Inc.
4Patents
4Active
4Granted
44Portfolio score
Filing activity: Oct 20, 2009 → Oct 4, 2011
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9451693B2 | Electrically conductive adhesive (ECA) for multilayer device interconnects | Emerging Cross-Sectional Technologies | 1 | Active |
| US9351408B2 | Coreless layer buildup structure with LGA and joining layer | Electricity | 0 | Active |
| US9420689B2 | Method of making a circuitized substrate | Emerging Cross-Sectional Technologies | 0 | Active |
| US9756724B2 | Method of making a circuitized substrate | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.