Conical-shaped or tier-shaped pillar connections
US9425136B2 · kind B2 · utility
17Cited by
113References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2012 |
| Grant date | Aug 23, 2016 |
| Priority date | — |
| Expiry date | Apr 17, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pillar structure for a substrate is provided. The pillar structure may have one or more tiers, where each tier may have a conical shape or a spherical shape. In an embodiment, the pillar structure is used in a bump-on-trace (BOT) configuration. The pillar structures may have circular shape or an elongated shape in a plan view. The substrate may be coupled to another substrate. In an embodiment, the another substrate may have raised conductive traces onto which the pillar structure may be coupled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.