Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
US9427776B2 · kind B2 · utility
1Cited by
1References
11Claims
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Key dates
| Filing date | Nov 29, 2012 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Aug 27, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0118
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Methods for reducing wafer bow induced by an anti-reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an anti-reflective coating material through the shadow mask onto a planar side of a cap wafer to provide a discontinuous coating on the planar side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.