Plasma processing method and apparatus
US9431263B2 · kind B2 · utility
2Cited by
0References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2015 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | May 22, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4583
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing method to a substrate includes a first step of mounting a transfer carrier holding the substrate on a stage which is cooled and provided within a processing chamber; a second step of relatively moving the stage and a cover provided above the stage to cover a holding sheet and an annular frame of the transfer carrier with the substrate exposed from a window part formed at the cover, a third step of carrying out plasma processing on the substrate, a fourth step of cooling the cover, and a fifth step of unloading the transfer carrier holding the substrate from the processing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.