Wafer inversion mechanism
US9431282B2 · kind B2 · utility
0Cited by
15References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 21, 2012 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Jul 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A BOLTS compatible module includes a support mechanism for gripping a wafer. The support mechanism is coupled to a rotary mechanism for rotating the support mechanism with a wafer grip therein. The rotary mechanism is coupled to the module and capable of at least 180° of rotation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.